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  • Capability

PCB manufacturing Capability


Layer count

 Mass production:1~12 layer  /   Sample:20 layer

Max. board thickness

 Mass production: 3.2mm  /  Sample: 10mm

Base material

 FR-4(Tg 135 FR4, Tg 150 FR4, Tg 180 FR4)Halon free FR4PTFE(TeflonRogers)

 PI materialBT materialTACONIC,PPOPPEceramic base, copper base, aluminum base, iron base

Min. width/distance

Inner layer 3mil/3mil(HOZ),  Out layer 4mil/4mil(1OZ)

Min. drill hole size

 Mechanical drilling: 8 mil (0.20mm)  /  Laser drilling: 3 mil (0.075mm)

 Aspect ratio

 18:1

Max. finished board size

 1150mm X 560mm

Max. copper thickness

Mass production:6.0 OZ (UL)  /  Sample: 20OZ

Max. gold thickness

 Au-120uin with Ni-200 uin

Surface finish

 HASLENIGImmersion TinImmersion silverOSPGolden fingerENIG+OSPPlated gold

Special process

 Blind holeBuried holeEmbedded resistor & capacitorCarbon oilPeelable solder
 

PCB SMT capacility


SMT range

+/-0.03mm       SOP/QFP/CSP/BGA/chip

SMT Tolerance

+/-0.05mm

Gauge RR%

+/-0.03mm

Min.Board Size

L50mm*W50mm

Max.Board Size

L510mm*W460mm

PCB Thickness

0.2mm-3.5mm

Process

Lead, Lead Free,SMT Red Gum